![]() shrinkage ratio of the pressure sensor installed in the specimen mold is essential, amount of pressure sensor is that it is appropriate approximately 2-3. #MOLDFLOW PLASTIC INSIGHT 6 1 CRACKED ISO#Process for the shrinkage of the plastic that provides how made, yet it has identified a process for making the question whether the shrinkage that can be trusted, and by the experimental results were as follows: as shrinkage, see ISO but, according to circumstances the process can go to the agreement between the parties. Shrinkage rate in effect at the time of mold design will soon determine the size of the global product. It is true that the plastic shrinkage is inevitable. Also, as a practical design for heat sink based on polymer composite, composite and metal sheet hybrid structures are investigated for LED lamp heat sink and audio amplication module housing to find that this hybrid structure can be a good solution considering all of the cooling performance, manufacturing, mechanical performance, cost and weight. For practical use of conductive composite, the thermal conductivity required depending on the heat releasing mode are studied first for simplified unit cooling geometry to propose thermal conductivities of the composites for reasonable cooling performance comparing with the metal heat sink as a reference. ![]() The practical use of these composites, however, is yet limited to specific applications because most composites are still not conductive enough or too difficult to process, too brittle, too expensive for higher conductivity. Using these conductive fillers, the polymer composites in the market show wide range of thermal conductivity from approximately 1 W/mK to 20 W/mK, which is quite enhanced considering the thermal conductivity lower than 0.5 W/mK for most polymeric materials. Carbon or ceramic materials like graphite, carbon nanotube or boron nitride are typical conductive fillers with good thermal or electical conductivity. Thermally or electrically conductive filler reinforced polymer composites are extensively being developed as the demand for light weight material increases rapidly in industiral applications need good conductivity such as heat sink of the electronics or light. Based on the present study, further comparative investigations with experimental photo RIM should be performed to find optimal processing conditions for produce ultra thin LGPs. At this region, injected resin fully filled the cavity without micro leakage behavior. Finally, we obtained optimal inlet pressure around 600 ~ 1,000 Pa. At low inlet pressure (less than 100 Pa), though the micro leakage problem was not occurred, another problem, short shot due to not enough driving force, was appeared More than 1,000 Pa of the inlet pressure, injected resin was rapidly leaked through the micro gap at the cavity edge. In order to obtain optimal processing conditions, we regulated inlet pressure of injected resin at the cavity edge and figured out micro leakage behaviors. In this study, micro leakage problem at cavity edge during photo RIM was investigated numerically. In order to verify the performance of cutting process, the roughness of cutting section of the part was measured and was satisfied in requirement.ĭespite technological advance, there have been several troubles in photo reaction injection molding (photo RIM) to produce ultra thin light guide panels (LGPs). For design of punch and die, the cold press cutting analysis was implemented by $DEFORM-2D^$ ln consideration of the simulation results, an adequate punch and die was designed and made for the cutting unit. ln this study, the cold press cutting process was applied to remove the gates. ![]() After injection molding process the side gates were needed to remove for further assembly process. The LGA IC socket plastic part was manufacture by injection molding process, it was needed accuracy, stiffness and suit resin with high flowability. LGA(Land Grid Array) IC socket with thin wall thickness was designed to satisfy this requirement. ![]() In the semiconductor industry the memory and chip were developed to high density memory and high performance chip, so circuit design was also high integrated and the test bed was needed to be thin and fine pitch socket. ![]()
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